ORBIS™ 3000 MEMS Manufacturing Systems
Memsstar’s ORBIS™ 1000 and ORBIS™ 3000 production systems offer a flexible, scalable path from research and development to full-scale volume MEMS manufacturing. The ORBIS 3000 enables fully automated wafer handling and cluster tool capability for up to three integrated XERIC™ or AURIX™ process modules, offering unparalleled flexibility and efficiency in etch and deposition processes. Each module is designed for high performance with small-volume vacuum chambers, tight process control, and compatibility with all standard wafer sizes from 100 mm to 200 mm. With ORBIS, fabs can start small and expand as their MEMS production capacity, productivity, or process capability grows — making it a future-ready investment for any microfabrication facility.
- Seamless upgrade path from ORBIS 1000 (R&D) to ORBIS 3000 (production)
- Fully automated wafer handling on ORBIS 3000
- Cluster configuration for up to 3 process modules (XERIC™ or AURIX™)
- Compact, cleanroom-ready footprint
- All standard wafer sizes supported (100–200 mm)
- Onboard chemicals & electronics for non-toxic processes
- Small-volume vacuum chambers for high process control
- Excellent within-wafer uniformity and wafer-to-wafer repeatability
- Fast process cycles and dense, robust thin films
- Easily maintained, with industry-standard components
- Backed by memsstar’s expert service & support
- Volume production of MEMS devices
- Wafer-level etch and deposition for sensors, actuators, RF MEMS
- Transition from lab-scale R&D to fab-scale manufacturing
- Clustered process integration (etch, clean, release, coating)
- High-uniformity film deposition for MEMS packaging
- Aerospace & defense microdevices
- Research institutes and universities
- Semiconductor & MEMS fabrication
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