ORBIS™: Redefining MEMS Manufacturing—From Lab to Fab

For decades, MEMS (Micro-Electro-Mechanical Systems) development relied on tools designed for semiconductor fabrication—tools that weren’t built to meet the specific demands of MEMS technology. With the introduction of the ORBIS™ platform, memsstar has transformed the way MEMS are designed, developed, and manufactured.

Why MEMS Require a Different Approach

MEMS devices combine miniature mechanical and electrical components, enabling powerful functionalities in compact formats. They are critical to fields such as automotive, healthcare, aerospace, and consumer electronics. However, unlike traditional integrated circuits (ICs), MEMS manufacturing involves:

Complex 3D microstructures
Diverse materials (metals, polymers, ceramics)
Smaller batch sizes and custom processes
These unique requirements challenge conventional semiconductor tools—and that’s where the ORBIS™ platform steps in.

How ORBIS™ Solves MEMS Manufacturing Challenges

✔ Complex 3D Structures

Unlike ICs, MEMS devices often need high-aspect-ratio, three-dimensional structures. The ORBIS™ platform uses advanced etching and deposition technologies to create these geometries with exceptional precision—both vertically and laterally—ensuring high performance and functional reliability.

✔ Material Flexibility

MEMS fabrication goes beyond silicon. It requires handling a wide array of materials with different thermal, electrical, and mechanical properties. ORBIS™ supports selective etching and deposition of metals, ceramics, and polymers, allowing multi-material integration in a single, reliable platform.

✔ Optimized for Low-to-Medium Volumes

MEMS production is typically done in smaller batches than semiconductor fabs. ORBIS™ systems are designed to be cost-effective and scalable—from prototyping to full production—without sacrificing yield or process repeatability.

The ORBIS™ Platform Family

memsstar has developed several configurations of the ORBIS™ platform, each tailored to different stages of MEMS development—from academic research to high-volume production:

ORBIS ALPHA™ – For Research & Universities

Ideal for MEMS R&D, ALPHA is built on proven continuous-flow processing and is already in use at institutions like Germany’s Walther-Meißner-Institut. It’s a cost-effective solution for developing next-generation MEMS processes.

ORBIS 1000 – Entry-Level Production & Development

A compact, automated single-wafer system ideal for low-volume production. ORBIS 1000 is fully upgradable to ORBIS 3000, providing a seamless transition as production demand grows.

ORBIS 3000 – Fully Automated MEMS Manufacturing

Designed for high-throughput production environments, ORBIS 3000 supports up to three process modules (XERIC™ for oxide/silicon etch, AURIX™ for surface prep/deposition). This cluster tool enables full process integration, scalability, and process flexibility.

Key Benefits at a Glance
✔ Seamless transition from R&D to volume production

✔ Compact footprint and low cost of ownership

✔ Configurable for multiple MEMS applications

✔ Advanced etch and deposition control

✔ Single-wafer or cluster tool architecture

✔ Proven performance across industry and academia

A Future-Proof MEMS Solution

With the rapid growth of mobile, wearable, and IoT technologies, MEMS devices are more in demand than ever. memsstar continues to collaborate closely with both industry and research partners to refine and evolve the ORBIS™ platform—ensuring it remains a cutting-edge tool for 21st-century MEMS innovation.
Want to know more? Contact us for tailored solutions in MEMS design and fabrication, or explore how ORBIS™ can fit into your lab or production line.